The government is ready with an outline of next phase of India Semiconductor Mission (ISM) and discussions are on internally for its rollout, a senior government official said on Thursday. Speaking at IESA Vision Summit, Ministry of Electronics and IT Secretary S Krishnan said the government is also mulling supporting ambitious chip design projects in the country as well as semiconductor packaging designs. "The next stage of ISM is in the works. We have had discussions, discussions with many of the stakeholders, including many amongst you, as to how to design the programme. The design and the outline is ready, and there's undergoing detailed discussions internally in the government," he said. Krishnan in his virtual speech said that the second phase of ISM proposes to provide support for gases and other elements that are required for semiconductor production. He said that the first phase of ISM had a total outlay of Rs 76,000 crore comprising Rs 65,000 crore for chip manufacturing